NEGATIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMATION METHOD

Title:

NEGATIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMATION METHOD

Document Type and Number:

WIPO Patent Application WO/2016/153044

Kind Code:

A1

Abstract:

Provided is a negative photosensitive composition that contains an epoxy group-containing resin (A) and a cation polymerization initiator (B) and is characterized in that the cation polymerization initiator (B) has: one or more types of cation polymerization initiator (B0) selected from the group consisting of compounds represented by formula (b0-1) and compounds represented by formula (b0-2); and a cation polymerization initiator (B1) that generates an acid having a pKa of -3 or more [In the formula, Rb01-Rb04 are each independent aryl groups that may have a fluorine atom or a substituent group. Rb05 is a fluorinated alkyl group that may have a fluorine atom or a substituent group, and a plurality of Rb05 may be the same or may be different. q is an integer of 1 or more, and Qq+ are each independent organic cations having a valence of q].

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Inventors:

IMAI HIROFUMI (JP)
ANDO TOMOYUKI (JP)

Application Number:

PCT/JP2016/059657

Publication Date:

September 29, 2016

Filing Date:

March 25, 2016

Export Citation:

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Assignee:

TOKYO OHKA KOGYO CO LTD (JP)

International Classes:

G03F7/004; G03F7/038

Foreign References:

JP2014203062A	2014-10-27
JP2012141578A	2012-07-26
JP2005055865A	2005-03-03
JP2011164216A	2011-08-25
JP2010197568A	2010-09-09

Other References: