Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT AND DISPLAY DEVICE EACH PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/057281
Kind Code:
A1
Abstract:
Provided is an alkali developable negative photosensitive resin composition which enables the achievement of a cured film that has a patterned shape with high resolution and low taper, while exhibiting excellent heat resistance and excellent light blocking properties. This negative photosensitive resin composition is characterized by containing (A1) a first resin, (A2) a second resin, (C) a photopolymerization initiator and (D) a coloring agent, and is also characterized in that: the first resin (A1) is composed of (A1-1) a polyimide and/or (A1-2) a polybenzoxazole; the second resin (A2) is composed of one or more substances selected from among (A2-1) a polyimide precursor, (A2-2) a polybenzoxazole precursor, (A2-3) a polysiloxane, (A2-4) a cardo resin and (A2-5) an acrylic resin; and the content ratio of the first resin (A1) in 100% by mass of the total of the first resin (A1) and the second resin (A2) is within the range of 25-90% by mass.
Inventors:
TANIGAKI YUGO (JP)
KAMEMOTO SATOSHI (JP)
MIYOSHI KAZUTO (JP)
KAMEMOTO SATOSHI (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2016/078282
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/037; C08F2/50; C08F290/08; G03F7/004; G03F7/027; G03F7/038; G03F7/075; H01L51/50; H05B33/12; H05B33/22; H05B33/28
Domestic Patent References:
| WO2007145249A1 | 2007-12-21 |
Foreign References:
| JP2004152590A | 2004-05-27 | |||
| JP2014170080A | 2014-09-18 | |||
| JP2013232314A | 2013-11-14 |
Attorney, Agent or Firm:
SEIRYU PATENT PROFESSIONAL CORPORATION et al. (JP)
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