NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING SAID COMPOSITION, AND METHOD FOR PRODUCING CURED RELIEF PATTERN

WIPO Patent Application WO/2019/107250

A1

The present invention provides: a negative photosensitive resin composition that achieves a high resolution, and suppresses the occurrence of voids at an interface of a Cu layer contacting a resin layer after a high-temperature storage test; a method for producing said composition; and a method for forming a cured relief pattern. This negative photosensitive resin composition comprises: (A) a polyimide precursor; (B) a base protected compound; and (C) a photopolymerisation initiator. The base protected compound: comprises multiple amino groups protected by a group which is deprotected by an acid, a base or heat; has a molecular weight of 250–600; the protected multiple amino groups are aliphatic-chain or alicyclic amino groups; and has a solubility parameter value of 20.0–24.0.

WO/2008/132842	PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND PROCESSED PRODUCT USING THE DRY FILM
JP3285674	ELECTRODEPOSITION COATING COMPOSITION FOR PRINTED CIRCUIT PHOTORESIST AND MANUFACTURE OF PRINTED CIRCUIT BOARD USING THE SAME
JP6663320	Tetracarboxylic diandies diester compound, polymer of polyimide precursor and method for producing the same, negative photosensitive resin composition, pattern forming method, and cured film forming method.

SHIOSAKI SHUJIRO (JP)
HIRATA TATSUYA (JP)

PCT/JP2018/043050

June 06, 2019

November 21, 2018

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ASAHI CHEMICAL IND (JP)

G03F7/027; C08G73/10; C08L79/08; G03F7/004; G03F7/20

WO2009136557A1	2009-11-12
WO2010113813A1	2010-10-07

JP2015151405A	2015-08-24
CN107189067A	2017-09-22
US6017682A	2000-01-25

AOKI, Atsushi et al. (JP)

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