Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044817
Kind Code:
A1
Abstract:
This negative photosensitive resin composition contains a thermosetting resin, a photopolymerization initiator and a coupling agent which contains an acid anhydride as a functional group. It is preferable that the thermosetting resin contains a polyfunctional epoxy resin. It is also preferable that the content of the polyfunctional epoxy resin is 40-80% by mass relative to the nonvolatile components of the negative photosensitive resin composition. It is also preferable that the coupling agent is a compound containing an alkoxysilyl group, which comprises succinic acid anhydride as a functional group.
Inventors:
SUZUKI SAKIKO (JP)
YAMAKAWA YUTA (JP)
TAKAHASHI YASUNORI (JP)
YAMAKAWA YUTA (JP)
TAKAHASHI YASUNORI (JP)
Application Number:
PCT/JP2018/031738
Publication Date:
March 07, 2019
Filing Date:
August 28, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/038; G03F7/004; G03F7/075
Domestic Patent References:
| WO2015194639A1 | 2015-12-23 |
Foreign References:
| JP2017111382A | 2017-06-22 | |||
| JP2015059167A | 2015-03-30 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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