NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION

Title:

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2012/133429

Kind Code:

A1

Abstract:

[Problem] To provide a negative photosensitive resin composition, which can be formed into a thick film even a solution thereof has a low viscosity, which is free from tack even before exposure, which can be patterned with high resolution by alkaline development, and a coating film formed from which has high transparency and is reduced in shrinkage after post baking. [Solution] A photosensitive resin composition which contains the following component (A), component (B), component (C) and component (D). Component (A): an acrylic copolymer which is obtained by copolymerizing a monomer mixture that contains at least (i) maleimide and (ii) a monomer having an epoxy group Component (B): a photoacid generator Component (C): a compound having two or more epoxy groups Component (D): a solvent

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Inventors:

HATANAKA TADASHI (JP)
HATTORI HAYATO (JP)
UCHIYAMA MEGUMI (JP)

Application Number:

PCT/JP2012/057965

Publication Date:

October 04, 2012

Filing Date:

March 27, 2012

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Assignee:

NISSAN CHEMICAL IND LTD (JP)
HATANAKA TADASHI (JP)
HATTORI HAYATO (JP)
UCHIYAMA MEGUMI (JP)

International Classes:

G03F7/038; C08F220/32; C08F222/40; G03F7/004

Foreign References:

JPH06250390A	1994-09-09
JP2004051876A	2004-02-19
JP2008026660A	2008-02-07
JPH03192260A	1991-08-22
JP2007171973A	2007-07-05

Attorney, Agent or Firm:

HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)

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