Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/080908
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a negative photosensitive resin composition making it possible to obtain a hardened layer having excellent characteristics in terms of high transparency, high permittivity, and low leak current and having properties that are maintained without degrading even upon being subjected to a chemical treatment or a treatment under a high temperature. The means for addressing the problem is a photosensitive resin composition containing: metal oxide particles of a metal selected from the group consisting of titanium, barium, hafnium, tantalum, tungsten, yttrium, and zirconium; (B) an alkali-soluble polyester resin having a radical polymerizable group and an aromatic ring; (C) a multi-functional (meth) acryloyl compound; and (D) a photopolymerization initiator.
Inventors:
HIBINO TOSHIYASU (JP)
ARAKI HITOSHI (JP)
SUWA MITSUHITO (JP)
ARAKI HITOSHI (JP)
SUWA MITSUHITO (JP)
Application Number:
PCT/JP2013/081169
Publication Date:
May 30, 2014
Filing Date:
November 19, 2013
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; C08G63/42; G03F7/027; G03F7/075
Foreign References:
| JP2011116943A | 2011-06-16 | |||
| JP2004069754A | 2004-03-04 | |||
| JP2010138251A | 2010-06-24 | |||
| JP2011151164A | 2011-08-04 | |||
| JP2013238837A | 2013-11-28 | |||
| JP2013237804A | 2013-11-28 |
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