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Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/117018
Kind Code:
A1
Abstract:
Provided is a negative photosensitive resin composition which allows a partition wall to be satisfactorily adhered to a substrate and can reduce residues in an opening in order to be applied to a highly precise optical element, and which is used to manufacture an optical element, for example, a quantum dot display, a TFT array, a thin-film solar battery, etc. The negative photosensitive resin composition is characterized by containing: an alkali-soluble resin which has an acid value of 40 mg/KOH/g or more, and which includes an aromatic ring in a main chain and has, in a molecule, an acidic group and an ethylenic double bond; a photo-radical polymerization initiator; and a compound (I) represented by formula (I). (R is a hydrogen atom or a methyl group, n is an integer of 2 or more, X is an organic group of n value, and Q is -CH2- or a single bond. When Q is a single bond, the end of X bonded to Q does not include -C(=O). The group surrounded by n of 2 or more may be identical or different.)

Inventors:
YAMADA KOTARO (JP)
TAKAHASHI HIDEYUKI (JP)
KAWASHIMA MASAYUKI (JP)
Application Number:
PCT/JP2018/044977
Publication Date:
June 20, 2019
Filing Date:
December 06, 2018
Export Citation:
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Assignee:
AGC INC (JP)
International Classes:
C08F2/48; G03F7/027; C08G75/04; G03F7/004; G03F7/075
Domestic Patent References:
WO2011081150A12011-07-07
Foreign References:
JP2008292677A2008-12-04
JPH1095892A1998-04-14
Attorney, Agent or Firm:
SENMYO Kenji et al. (JP)
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