Title:
NEGATIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2006/075625
Kind Code:
A1
Abstract:
A negative resist composition which can give a resist pattern inhibited from swelling. The negative resist composition comprises (A) an alkali-soluble resin ingredient, (B) an acid generator ingredient which generates an acid upon exposure to light, and (C) a crosslinking agent ingredient, wherein the alkali-soluble resin ingredient (A) is a copolymer (A1) comprising a structural unit (a1) having in the backbone an alicyclic group having a fluorinated hydroxyalkyl group, a structural unit (a2) derived from an acrylic ester having a hydroxylated, chain or cyclic alkyl group and having a fluoroalkyl group or fluorine atom bonded in the &agr -position, and a structural unit (a3) derived from an acrylic ester which has an alicyclic group having a fluorinated hydroxyalkyl group and has a fluoroalkyl group or fluorine atom bonded in the &agr -position.
Inventors:
IWASHITA JUN (JP)
Application Number:
PCT/JP2006/300222
Publication Date:
July 20, 2006
Filing Date:
January 11, 2006
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
IWASHITA JUN (JP)
IWASHITA JUN (JP)
International Classes:
G03F7/038; C08F220/22; C08F232/08; G03F7/004; H01L21/027
Foreign References:
JP2005003863A | 2005-01-06 | |||
US20030129527A1 | 2003-07-10 | |||
JP2004217533A | 2004-08-05 | |||
JP2000281729A | 2000-10-10 |
Attorney, Agent or Firm:
Tanai, Sumio (Yaesu, Chuo-ku Tokyo 53, JP)
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