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Patent Searching and Data


Title:
NEGATIVE THERMAL EXPANSION MATERIAL, NEGATIVE THERMAL EXPANSION THIN FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/042033
Kind Code:
A1
Abstract:
Disclosed are a negative thermal expansion material, and a preparation method therefor, wherein the negative thermal expansion material comprises Eu 0.85Cu 0.15Mn 3- δ, wherein 0≤ δ ≤2, and a thin film prepared by using the negative thermal expansion material and a preparation method for the thin film.

Inventors:
LI WEI (CN)
GUO PAN (CN)
CHEN YANQING (CN)
WANG NING (CN)
QIN WEIDA (CN)
XIN HAOYI (CN)
LI YANFENG (CN)
LI CHAO (CN)
WANG YONGCHAO (CN)
Application Number:
PCT/CN2018/095991
Publication Date:
March 07, 2019
Filing Date:
July 17, 2018
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
ORDOS YUANSHENG OPTOELECTRONICS CO LTD (CN)
International Classes:
C04B35/50; C04B35/622; C23C14/08; C23C14/34; C23C14/35; C23C14/58; H05K1/02
Domestic Patent References:
WO2010101153A12010-09-10
Foreign References:
CN107573070A2018-01-12
US20060019107A12006-01-26
CN1850721A2006-10-25
US5322559A1994-06-21
US20030218268A12003-11-27
Attorney, Agent or Firm:
BEIJING INTELLEGAL INTELLECTUAL PROPERTY AGENT LTD. (CN)
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