Title:
NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND ORGANIC EL DISPLAY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/087985
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain: a cured film that has high sensitivity, enables formation of a pattern of a low-tapered shape after development, is capable of suppressing a change in the dimensional width of pattern openings before and after thermal curing, and exhibits excellent light-shielding properties; and a negative-type photosensitive resin composition used to form said cured film. This negative-type photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerization initiator (C1), and a black colorant (Da), wherein: the alkali-soluble resin (A) has a fluorine atom-containing structural unit in a specific proportion and comprises a first resin (A1) that contains at least one selected from the group consisting of polyimides (A1-1), polyimide precursors (A1-2), polybenzoxazoles (A1-3), and polybenzoxazole precursors (A1-4); and the photopolymerization initiator (C1) comprises an oxime ester-based photopolymerization initiator (C1-1) having a specific structure.
Inventors:
TANIGAKI YUGO (JP)
MIYOSHI KAZUTO (JP)
MIYOSHI KAZUTO (JP)
Application Number:
PCT/JP2018/039958
Publication Date:
May 09, 2019
Filing Date:
October 26, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; C07C251/66; C07C323/37; C09B67/46; G02F1/1335; G02F1/1339; G03F7/027; G03F7/031; G03F7/037; G03F7/075; G03F7/20; G09F9/00; G09F9/30; H01L27/32; H01L51/50; H05B33/02; H05B33/10; H05B33/22; C09B5/24; C09B5/62; C09B7/00; C09B19/02; C09B47/04; C09B56/02; C09B57/00; C09B57/04; C09B57/12
Domestic Patent References:
| WO2017057281A1 | 2017-04-06 | |||
| WO2016158672A1 | 2016-10-06 | |||
| WO2017057143A1 | 2017-04-06 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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