Ni BALL, Ni CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM

Title:

Ni BALL, Ni CORE BALL, SOLDER JOINT, SOLDER PASTE, AND SOLDER FOAM

Document Type and Number:

WIPO Patent Application WO/2015/118613

Kind Code:

A1

Abstract:

Provided are: an Ni ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; an Ni core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60) is configured in a manner such that a solder bump (30) of a semiconductor chip (10) and an electrode (41) of a printed circuit board (40) are joined by a solder paste (12, 42). The solder bump (30) is formed by joining a solder ball (20) to an electrode (11) of the semiconductor chip (10). This solder ball (20) exhibits a purity of 99.9-99.995%, inclusive, a sphericity of 0.90 or higher, and a Vickers hardness of 20-90HV, inclusive.

Inventors:

KAWASAKI HIROYOSHI (JP)
AKAGAWA TAKASHI (JP)
KOIKEDA YUICHI (JP)
IKEDA ATSUSHI (JP)
SASAKI MASARU (JP)
ROPPONGI TAKAHIRO (JP)
SOMA DAISUKE (JP)
SATO ISAMU (JP)

Application Number:

PCT/JP2014/052571

Publication Date:

August 13, 2015

Filing Date:

February 04, 2014

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B22F1/065; B22F1/107; B22F1/16; B23K35/14; B23K35/22; B23K35/30; C22B23/06; C22C19/03; C22F1/00; C22F1/10; C25D7/00

Domestic Patent References:

WO1995024113A1	1995-09-08
WO2012120982A1	2012-09-13
WO2011114824A1	2011-09-22

Foreign References:

JP2010216004A	2010-09-30
JP2002093866A	2002-03-29
JP2005338072A	2005-12-08
JP2003249598A	2003-09-05
JP2011214061A	2011-10-27
JP2007115857A	2007-05-10

Other References: