Ni BALL, Ni NUCLEAR BALL, SOLDER JOINT, FOAM SOLDER AND SOLDER PASTE

Title:

Ni BALL, Ni NUCLEAR BALL, SOLDER JOINT, FOAM SOLDER AND SOLDER PASTE

Document Type and Number:

WIPO Patent Application WO/2015/040714

Kind Code:

A1

Abstract:

Provided is an Ni ball that has a low α-ray amount, even though containing a definite amount or more of impurity elements other than Ni, and has a high sphericity. An Ni ball wherein: the U content is controlled to 5 ppb or less; the Th content is controlled to 5 ppb or less; the purity is controlled to 99.9-99.995% inclusive; the α-ray amount is controlled to 0.0200 cph/cm2 or less; the content of Pb and/or Bi is controlled to 1 ppm or more; and the sphericity is controlled to 0.90 or more, in order to suppress soft errors and reduce connection failures.

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Inventors:

KURATA RYOICHI (JP)
AKAGAWA TAKASHI (JP)
KAWASAKI HIROYOSHI (JP)

Application Number:

PCT/JP2013/075288

Publication Date:

March 26, 2015

Filing Date:

September 19, 2013

Export Citation:

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Assignee:

SENJU METAL INDUSTRY CO (JP)

International Classes:

B22F1/05; B22F1/065; B22F1/17; B23K35/14; B23K35/22; B23K35/30; B23K35/40; C22C19/03; C22F1/00; C22F1/10; C22C13/00

Domestic Patent References:

WO2011114824A1	2011-09-22
WO2012120982A1	2012-09-13

Foreign References:

JP2005036301A	2005-02-10
JP2005161338A	2005-06-23
JP2011214061A	2011-10-27
JPH11261210A	1999-09-24

Other References: