Title:
Ni-COATED COPPER POWDER, CONDUCTIVE PASTE, CONDUCTIVE PAINT AND CONDUCTIVE SHEET USING SAME, AND METHOD FOR MANUFACTURING Ni-COATED COPPER POWDER
Document Type and Number:
WIPO Patent Application WO/2017/057231
Kind Code:
A1
Abstract:
Provided is a Ni-coated copper powder which increases the number of contact points between Ni-coated copper powder particles, thereby ensuring excellent conductivity and preventing agglomeration between the copper powder particles. Thus, the Ni-coated copper powder may be preferably used for conductive pastes, electromagnetic shields or the like. The Ni-coated copper powder according to the present invention is formed via the agglomeration of copper particles having specific shapes and Ni- or Ni alloy-coated surfaces into a dendritic shape or an agglomerate of the copper particles. This Ni-coated copper powder has a larger number of contact points between copper powder particles and thus exhibits excellent conductivity.
Inventors:
OKADA HIROSHI (JP)
Application Number:
PCT/JP2016/078181
Publication Date:
April 06, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B22F1/00; C22C19/03; C23C18/31; C25C5/02; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Foreign References:
| JP2012140661A | 2012-07-26 | |||
| JP2004162164A | 2004-06-10 | |||
| JPS64718A | 1989-01-05 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
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