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Title:
Ni-PLATED COPPER OR COPPER ALLOY MATERIAL, AND CONNECTOR TERMINAL, CONNECTOR, AND ELECTRONIC COMPONENT IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2017/154288
Kind Code:
A1
Abstract:
Provided is an Ni-plated copper or copper alloy material having both exceptional hardness and bending resistance. Provided is an Ni-plated copper or copper alloy material in which the area ratio of crystals in the <001> plane orientation in a crystal plane parallel to the Ni plating surface is 15-35% as measured by electron backscatter diffraction (EBSD).

Inventors:
ENDO SATORU (JP)
Application Number:
JP2016/085438
Publication Date:
September 14, 2017
Filing Date:
November 29, 2016
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/00; C25D5/20; H01R13/03
Foreign References:
JP2011063875A2011-03-31
JP2014077190A2014-05-01
JPH10204680A1998-08-04
JP2014181354A2014-09-29
Other References:
See also references of EP 3428324A4
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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