Title:
Ni-Si-Co COPPER ALLOY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2010/067863
Kind Code:
A1
Abstract:
Disclosed is a Ni-Si-Co copper alloy that is suitable for use for various kinds of electronic parts and has particularly good uniform plating adhesion properties. The copper alloy for electronic materials comprises Ni: 1.0‑2.5 mass%, Co: 0.5‑2.5 mass% and Si: 0.3‑1.2 mass% and the remainder is made of Cu and unavoidable impurities. For the copper alloy for electronic materials, the mean crystal size, at the plate thickness center, is 20 µm or less, and there are five or fewer crystal particles that contact the surface and have a long axis of 45 µm or greater per 1 mm rolling direction length. The copper alloy may comprise a maximum of 0.5 mass% Cr and may comprise a maximum in total of 2.0 mass% of one, two or more selected from a group comprising Mg, P, As, Sb, Be, B, Mn, Sn, Ti, Zr, Al, Fe, Zn and Ag.
Inventors:
KUWAGAKI,Hiroshi (Nippon Mining & Metals Co.Ltd.,1-1-2,Shirogane-cho,Hitachi-sh, Ibaraki 56, 〒3170056, JP)
Application Number:
JP2009/070753
Publication Date:
June 17, 2010
Filing Date:
December 11, 2009
Export Citation:
Assignee:
Nippon Mining & Metals Co.,Ltd. (10-1, Toranomon 2-chomeMinato-k, Tokyo 01, 〒1050001, JP)
日鉱金属株式会社 (〒01 東京都港区虎ノ門二丁目１０番１号 Tokyo, 〒1050001, JP)
日鉱金属株式会社 (〒01 東京都港区虎ノ門二丁目１０番１号 Tokyo, 〒1050001, JP)
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; H01B13/00; C22F1/00
Attorney, Agent or Firm:
AXIS Patent International (Yushi Kogyo Kaikan, 13-11Nihonbashi 3-chome,Chuo-k, Tokyo 27, 〒1030027, JP)