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Patent Searching and Data


Title:
NICKEL COATED COPPER AS ELECTRODES FOR EMBEDDED PASSIVE DEVICES
Document Type and Number:
WIPO Patent Application WO2003030186
Kind Code:
A3
Abstract:
The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passibe circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.

Inventors:
ANDRESAKIS JOHN A
SKORUPSKI EDWARD C
HERRICK WENDY
WOODRY MICHAEL D
Application Number:
PCT/US2002/029151
Publication Date:
December 04, 2003
Filing Date:
September 13, 2002
Export Citation:
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Assignee:
OAK MITSUI INC (US)
International Classes:
C25D1/04; B32B15/01; C25D5/16; C25D5/34; C25D7/06; C25D15/02; H01B5/02; H01C1/14; H01C7/00; H05K1/16; H05K3/38; (IPC1-7): H05K1/16
Foreign References:
EP0460856A21991-12-11
EP0955643A11999-11-10
US6242997B12001-06-05
GB2285813A1995-07-26
US4483906A1984-11-20
Other References:
See also references of EP 1435193A2
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