Title:
NICKEL COATED COPPER AS ELECTRODES FOR EMBEDDED PASSIVE DEVICES
Document Type and Number:
WIPO Patent Application WO2003030186
Kind Code:
A3
Abstract:
The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passibe circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
Inventors:
ANDRESAKIS JOHN A
SKORUPSKI EDWARD C
HERRICK WENDY
WOODRY MICHAEL D
SKORUPSKI EDWARD C
HERRICK WENDY
WOODRY MICHAEL D
Application Number:
PCT/US2002/029151
Publication Date:
December 04, 2003
Filing Date:
September 13, 2002
Export Citation:
Assignee:
OAK MITSUI INC (US)
International Classes:
C25D1/04; B32B15/01; C25D5/16; C25D5/34; C25D7/06; C25D15/02; H01B5/02; H01C1/14; H01C7/00; H05K1/16; H05K3/38; (IPC1-7): H05K1/16
Foreign References:
EP0460856A2 | 1991-12-11 | |||
EP0955643A1 | 1999-11-10 | |||
US6242997B1 | 2001-06-05 | |||
GB2285813A | 1995-07-26 | |||
US4483906A | 1984-11-20 |
Other References:
See also references of EP 1435193A2
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