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Title:
NICKEL-COPPER ALLOY POWDER, PROCESS FOR PRODUCING THE NICKEL-COPPER ALLOY POWDER, CONDUCTIVE PASTE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2010/035573
Kind Code:
A1
Abstract:
Disclosed is a nickel-copper alloy powder of ultrafine particles.  Also disclosed is a process for mass-producing the alloy powder of ultrafine particles.  Also disclosed is an electronic component that comprises a conductor film in a thin layer form formed, using a conductive paste of the nickel-copper alloy powder of ultrafine particles, on a surface of an insulator and can suppress the occurrence of delamination and the like. The alloy powder comprises nickel and copper, has an average particle diameter of 5 to 30 nm, and exhibits such an X-ray diffraction pattern that the highest diffraction intensity among the diffraction intensity of a main peak of an alloy that comprises the nickel and the copper and has a hexagonal close-packed structure (hcp), the diffraction intensity of a main peak of an oxide of the nickel, and the diffraction intensity of a main peak of an oxide of the copper is not more than 10% of the diffraction intensity of a main peak of an alloy that comprises the nickel and the copper and has a cubic close-packed structure (ccp).  A conductive paste is prepared from the alloy powder.  The conductive paste is printed on a surface of an insulator, followed by sintering to obtain a sintered compact and thus to produce an electronic component.

Inventors:
TERASHI YOSHITAKE (JP)
Application Number:
PCT/JP2009/063389
Publication Date:
April 01, 2010
Filing Date:
July 28, 2009
Export Citation:
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Assignee:
KYOCERA CORP (JP)
TERASHI YOSHITAKE (JP)
International Classes:
B22F1/054; B22F9/24; C22C9/06; C22C19/03; H01B1/02; H01B1/22; H01B5/00; H01B5/14; H01B13/00; H01G4/12
Foreign References:
JPH10183207A1998-07-14
JP2006169559A2006-06-29
JPH0320907A1991-01-29
JPH0711367A1995-01-13
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