NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD IN WHICH SAID MATERIAL IS USED

Title:

NICKEL PARTICLE COMPOSITION, BONDING MATERIAL, AND BONDING METHOD IN WHICH SAID MATERIAL IS USED

Document Type and Number:

WIPO Patent Application WO/2016/002741

Kind Code:

A1

Abstract:

　A nickel particle composition contains: A) nickel particles having an average particle diameter of 0.5-20 µm as measured with laser diffraction/scattering, the particles containing at least 50% by weight or more of elemental nickel; B) nickel particles having an average primary particle diameter of 30-200 nm as measured with a scanning electron microscope, the particles containing 50% by weight or more of elemental nickel; and C) an organic binder in an amount of 0.1-2.5% by weight in relation to the total metal content, the weight ratio of component A and component B (component A:component B) being 30:70 to 70:30.

Inventors:

SHIMIZU TAKAYUKI (JP)

Application Number:

PCT/JP2015/068757

Publication Date:

January 07, 2016

Filing Date:

June 30, 2015

Export Citation:

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Assignee:

NIPPON STEEL & SUMIKIN CHEM CO (JP)

International Classes:

B22F1/052; B22F1/107; B22F3/02; B22F7/04; B22F7/08; B23K20/00; B23K35/22; B23K35/30; H01B1/00; H01B1/22; H01L21/52; H01L23/373; B22F9/24; C22C19/03

Domestic Patent References:

WO2002035554A1

2002-05-02

Foreign References:

JP2000331534A	2000-11-30
JPH05255709A	1993-10-05

Other References: