NICKEL POWDER, METHOD FOR PRODUCING SAME, CONDUCTIVE COMPOSITION, AND CONDUCTIVE FILM

WIPO Patent Application WO/2022/137691

A1

The present invention pertains to a nickel powder or an aggregate of nickel particles having a 50%-particle diameter D50 of 100 nm or less in a number distribution obtained through measurement performed with scanning electron microscope observation. The contained amount of boron (B) elements in the nickel particles is 0.1-1.0 mass%. Further, when measurement by TOF-SIMS is performed in a range from the outermost surface of the powder to a sputtering depth of 10 nm, in terms of SiO2, of the powder, a ratio (Amax/A1), which is obtained by dividing the maximum value Amax of the ratio of the detected ion number of B elements with respect to the detected ion number of Ni elements by the ratio A1 of the detected ion number of B ions with respect to the detected ion number of Ni ion at the outermost surface of the powder, is 12 or more. The present invention also provides a production method for reducing Ni ions, by forming a nickel-hydrazine complex and then adding thereto a boron element-containing reductive compound. The present invention further provides a conductive composition and a conductive film, in which said nickel powder is used.

UESUGI HIDEO (JP)
ENDO YASUTOSHI (JP)
ASANO TAKUYA (JP)

PCT/JP2021/035400

June 30, 2022

September 27, 2021

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MITSUI MINING & SMELTING CO LTD (JP)

B22F9/24; B22F1/00; C22C19/03; C25B1/04; C25B11/073; H01B1/00; H01B1/02; H01B1/22; H01B5/00; H01B5/16; H01B13/00; H01M4/90

JP2007277709A	2007-10-25
CN103894623A	2014-07-02
JPH04104470A	1992-04-06
JPS54123582A	1979-09-25
JP2014156640A	2014-08-28
JP2015151590A	2015-08-24

SHOWA INTERNATIONAL PATENT FIRM (JP)

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