NICKEL SOLUTION FOR FORMING FILM AND FILM-FORMING METHOD USING SAME

Title:

NICKEL SOLUTION FOR FORMING FILM AND FILM-FORMING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2015/050192

Kind Code:

A1

Abstract:

　Provided is a nickel solution for forming a film that makes it possible to inhibit generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are in contact with each other. A nickel solution for forming a film for supplying nickel ions to the solid electrolyte membrane when the solid electrolyte membrane is disposed between a positive electrode and a substrate functioning as a negative electrode, the solid electrolyte membrane is brought into contact with the substrate, a voltage is applied between the positive electrode and the substrate, and nickel is caused to deposit onto the surface of the substrate from nickel ions contained in the solid electrolyte membrane, whereby a nickel coating comprising the nickel is formed on the surface of the substrate, wherein the nickel solution has a pH value in the range of 4.2 to 6.1 and further contains a pH buffering solution that has a buffering function in the abovementioned pH range and that does not form an insoluble salt or a complex with the nickel ions during film formation.

Inventors:

HIRAOKA MOTOKI (JP)
YANAGIMOTO HIROSHI (JP)
SATO YUKI (JP)
SHIMMEI YOSHITAKA (JP)
AKAMATSU KENSUKE (JP)

Application Number:

PCT/JP2014/076378

Publication Date:

April 09, 2015

Filing Date:

October 02, 2014

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOYOTA MOTOR CO LTD (JP)

International Classes:

C25D17/00; C25D3/12

Domestic Patent References:

WO2013125643A1

2013-08-29

Foreign References:

JP2012219362A	2012-11-12
JP2005133187A	2005-05-26
JP2008522040A	2008-06-26
JPH01165786A	1989-06-29
JPH11209898A	1999-08-03
JP2010037622A	2010-02-18
JP2012219362A	2012-11-12

Other References: