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Patent Searching and Data


Title:
NODE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/057744
Kind Code:
A1
Abstract:
The present application provides a node and an electronic device. The node comprises a structure module, a circuit board, a liquid cooling pipe, and a liquid leakage monitoring device. The circuit board is fixedly mounted on the structure module, and is provided with an electronic device comprising a chip and the like. The liquid cooling pipe is provided on the circuit board and used for performing heat dissipation on the electronic device on the circuit board. The liquid leakage monitoring device comprises a drainage pipe sleeved on the outer side of the liquid cooling pipe; there is a certain interval between the drainage pipe and the liquid cooling pipe; and when a leakage occurs in the liquid cooling pipe, leaked cooling liquid flows in the drainage pipe instead of freely flowing to cause a problem such as a short circuit in the circuit board. A liquid receiving disc is connected to the drainage pipe, such that the leaked cooling liquid flows to the liquid receiving disc from the drainage pipe; a first liquid leakage sensor is provided in the liquid receiving disc; and when the first liquid leakage sensor detects that there is the leaked cooling liquid in the liquid receiving disc, an alarm signal is given so as to facilitate a system or an operator to perform processing such as data storage or outage, thereby reducing loss caused by leakage of the liquid cooling pipe.

Inventors:
SUN XIAOGUANG (CN)
GAO JUNEN (CN)
PENG HUAN (CN)
Application Number:
PCT/CN2021/117846
Publication Date:
March 24, 2022
Filing Date:
September 11, 2021
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G01M3/18; H05K7/20
Foreign References:
CN106527637A2017-03-22
CN110121249A2019-08-13
CN210893590U2020-06-30
JPH05129788A1993-05-25
CN202010994533A2020-09-21
Other References:
See also references of EP 4209765A4
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