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Title:
NON-AQUEOUS ADHESIVE COMPOSITION, RECORDING METHOD, METHOD FOR PRODUCING RECORDED MATTER, SET OF COMPOSITIONS, AND RECORDED MATTER
Document Type and Number:
WIPO Patent Application WO/2023/054472
Kind Code:
A1
Abstract:
Provided is a novel adhesive composition that can be discharged from a nozzle onto a base material and can fix a solid such as a powder or foil to the base material. A non-aqueous adhesive composition discharged from a nozzle, wherein the non-aqueous adhesive composition includes an organic solvent and a resin, the resin contains a resin A including the following monomer (a) as a constituent, and the proportion of the monomer (a) constituting the resin A is 50 mass% or more of the total monomer weight constituting resin A. (In formula (1), Ry is a hydrogen group or an optionally branched C1-12 hydrocarbon group. When Ry is a hydrogen group, Rx is a C1-18 hydrocarbon group that may be branched and may be monocyclic. When Ry is an optionally branched C1-12 hydrocarbon group, Rx is an optionally branched C2 -18 hydrocarbon group.)

Inventors:
ORIKASA YUKA (JP)
IDENOUE SATOSHI (JP)
YOSHIMORI KEISHIRO (JP)
SAITO YASUMA (JP)
UTAKA KOJUN (JP)
TAMURA MITSUYOSHI (JP)
Application Number:
PCT/JP2022/036177
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
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Assignee:
DNP FINE CHEMICALS CO LTD (JP)
International Classes:
C09J133/06; B41J2/01; B41M5/00; C09D11/30
Domestic Patent References:
WO2016013644A12016-01-28
Foreign References:
JP2016182675A2016-10-20
JP2007169492A2007-07-05
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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