Title:
NON-HEAT-ABSORBING COLOR COMPOSITION CONTAINING FINE METALLIC SEMICONDUCTOR POWDER, AND MOLDINGS
Document Type and Number:
WIPO Patent Application WO/1999/011715
Kind Code:
A1
Abstract:
A non-heat-absorbing color composition containing a fine metallic semiconductor powder, which may be a heat-reflecting or heat-permeable color composition. The fine powder may be that of silicon, for example, a fine solicon powder having an average particle diameter of not more than 100 $g(m)m. The color composition may further contain other pigment(s). Altermatively, the color composition may be a colored resin or colored paint composition. The color composition forms moldings themselves or moldings having layers comprising itself.
Inventors:
YAMAGUCHI YASUHIDE (JP)
Application Number:
PCT/JP1998/003812
Publication Date:
March 11, 1999
Filing Date:
August 27, 1998
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
YAMAGUCHI YASUHIDE (JP)
YAMAGUCHI YASUHIDE (JP)
International Classes:
C08J5/00; C08K3/00; C08K3/08; C08L101/00; C09D5/00; C09D7/61; C09D201/00; (IPC1-7): C08L101/00; C08K3/10; C09D201/00; C09D7/12
Foreign References:
| JPS4946196A | 1974-05-02 | |||
| JPS52126434A | 1977-10-24 | |||
| JPH10183062A | 1998-07-07 |
Attorney, Agent or Firm:
Watanabe, Mochitoshi (Iwamoto-cho 2-chome Chiyoda-ku Tokyo, JP)
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