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Title:
NON-PHOTOSENSITIVE SURFACE MODIFIER, LAYERED PRODUCT, PRINTED WIRING BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/199849
Kind Code:
A1
Abstract:
This non-photosensitive surface modifier is for forming a surface modification layer between a metal layer and a resin layer, and at least includes a heterocyclic compound having a structure of general formula (W) or general formula (Y), the heterocyclic compound being contained in a concentration of 0.001-0.01 mass%. [In the formulae, Rn1 and Rn2 each represent an alkyl group; L represents a linking group; W1 to W7 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and W1 to W7 form a fused ring together; Y1 to Y5 each represent a carbon atom or a nitrogen atom, at least two thereof being nitrogen atoms, one of which is NH, and Y1 to Y5 form a fused ring together; and m is an integer of 1 or larger.]

Inventors:
MIKOSHIBA EMIKO (JP)
HARA JUN (JP)
Application Number:
PCT/JP2023/014319
Publication Date:
October 19, 2023
Filing Date:
April 07, 2023
Export Citation:
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Assignee:
KONICA MINOLTA INC (JP)
International Classes:
C09D5/00; B32B15/04; C09D7/63; C09D201/00; C23C26/00; H05K3/06
Foreign References:
JPH04153290A1992-05-26
JP2006251385A2006-09-21
JP2006080473A2006-03-23
JP2011515542A2011-05-19
JP2007059451A2007-03-08
JPH0511439A1993-01-22
JPH0275637A1990-03-15
JP2003031929A2003-01-31
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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