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Title:
NONAQUEOUS DISPERSION CONTAINING FLUORINE-BASED RESIN; POLYIMIDE PRECURSOR SOLUTION COMPOSITION CONTAINING FLUORINE-BASED RESIN; POLYIMIDE, POLYIMIDE FILM AND ADHESIVE COMPOSITION FOR CIRCUIT BOARDS, EACH USING SAID POLYIMIDE PRECURSOR SOLUTION COMPOSITION CONTAINING FLUORINE-BASED RESIN; AND PRODUCTION METHODS THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/159102
Kind Code:
A1
Abstract:
In order to provide a dispersion wherein the dispersed state of a fluorine-based resin is uniformly controlled, a polyimide precursor solution composition using this dispersion, an adhesive composition, a polyimide and polyimide film obtained from this polyimide precursor solution composition and having excellent heat resistance, excellent mechanical characteristics, excellent electrical characteristics such as lower dielectric constant and lower dielectric loss tangent, and excellent processability, a method for producing the polyimide, a method for producing the polyimide film, and a circuit board and coverlay film using the polyimide film, the present invention provides: a polyimide precursor solution composition containing a fluorine-based resin, which is characterized by containing a polyimide precursor solution and a nonaqueous dispersion of a fluorine-based resin containing a micropowder of a fluorine-based resin and a butyral resin or a fluorine-based additive containing at least a fluorine-containing group and a lipophilic group; and an adhesive composition.

Inventors:
SATO ATSUSHI (JP)
ABE HIROSHI (JP)
SUZUKI TAKANORI (JP)
SHINMURA YUKAKO (JP)
Application Number:
PCT/JP2016/060433
Publication Date:
October 06, 2016
Filing Date:
March 30, 2016
Export Citation:
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Assignee:
MITSUBISHI PENCIL CO (JP)
International Classes:
C08L27/18; B32B15/08; C08J5/18; C08J5/24; C08K3/00; C08L79/08; C09J11/08; C09J163/00; C09J179/04; H05K1/03
Domestic Patent References:
WO2014148385A12014-09-25
Foreign References:
JP2008102171A2008-05-01
JP2006126246A2006-05-18
JPH0455437A1992-02-24
JP2013079326A2013-05-02
Attorney, Agent or Firm:
FUJIMOTO Eisuke et al. (JP)
Eisuke Fujimoto (JP)
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