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Title:
NONAROMATIC SOLVENT TYPE COATING RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2004/069945
Kind Code:
A1
Abstract:
The invention aims at providing a nonaromatic solvent type coating resin composition which is excellent in tight adhesion to a substrate, corrosion resistance, processability, scratch resistance, solvent resistance, and so on, and is well balanced among them. In the invention, the nonaromatic solvent constituting the composition is selected with attention paid to the evaporation rate and SP value of a mixed solvent and the viscosity of a solution of an epoxy resin therein having a solid content of 40 %. The invention relates to a nonaromatic solvent type coating epoxy resin composition characterized by consisting of a solution which is obtained by dissolving an epoxy resin composition in a specific nonaromatic solvent (i) and has a solid content of 60 % or below: (i) a mixed solvent which consists of nonaromatic solvents satisfying the relationship (1) and a solution in which of a modified epoxy resin composition exhibits a viscosity of 10,000mPa·s or below when the solid content of the solution is 40%: 9.0 < SP < 11.0 (wherein SP = ΣCiSPi) (1)

Inventors:
ARIKAWA HIDEO (JP)
TANAKA TOSHIYUKI (JP)
Application Number:
PCT/JP2004/001057
Publication Date:
August 19, 2004
Filing Date:
February 03, 2004
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
ARIKAWA HIDEO (JP)
TANAKA TOSHIYUKI (JP)
International Classes:
C08J3/09; (IPC1-7): C09D163/00; C09D175/04
Foreign References:
JPH08183834A1996-07-16
JP2000034438A2000-02-02
JPH08134403A1996-05-28
Other References:
See also references of EP 1591501A4
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