NONCONTACT IC LABEL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

Title:

NONCONTACT IC LABEL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/2006/041033

Kind Code:

A1

Abstract:

A noncontact IC label includes an electrically insulating first board; an antenna coil provided on one plane of the first board; an IC chip electrically connected to the antenna coil; a magnetic layer provided to cover the antenna coil and the IC chip on the one plane of the first board; a first adhesive layer provided through the magnetic layer; an electrically insulating second board provided through the first adhesive layer; a second adhesive layer provided through the second board; peeling paper provided through the second adhesive layer; and an upper member provided on the other plane of the first board through a third adhesive layer.

Inventors:

KAGAYA HITOSHI (JP)
IDE YOSHIAKI (JP)
YAMAKAMI TAKESHI (JP)
OHNO HIROKI (JP)

Application Number:

PCT/JP2005/018639

Publication Date:

April 20, 2006

Filing Date:

October 07, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOPPAN FORMS CO LTD (JP)
KAGAYA HITOSHI (JP)
IDE YOSHIAKI (JP)
YAMAKAMI TAKESHI (JP)
OHNO HIROKI (JP)

International Classes:

G06K19/077; B42D15/10; G06K19/07; H01F17/00; H01F17/04; H01L21/56; H04B5/02

Foreign References:

JP2000113142A	2000-04-21
JP2003099747A	2003-04-04
JPH0530874U	1993-04-23
JP2000311226A	2000-11-07

Other References: