NORMAL-TEMPERATURE BONDING DEVICE AND NORMAL-TEMPERATURE BONDING METHOD

Title:

NORMAL-TEMPERATURE BONDING DEVICE AND NORMAL-TEMPERATURE BONDING METHOD

Document Type and Number:

WIPO Patent Application WO/2012/043054

Kind Code:

A1

Abstract:

The normal-temperature bonding method of the present invention has: a step wherein two activated substrates are manufactured by activating two substrates; a step wherein a bonded substrate is manufactured by bonding those two activated substrates; and a step wherein that bonded substrate is annealed so as to reduce the residual stress of that bonded substrate. By means of a normal-temperature bonding method of this type it is possible to reduce the residual stress and improve the quality of the bonded substrates.

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Inventors:

TSUNO TAKESHI (JP)
GOTO TAKAYUKI (JP)
KINOUCHI MASATO (JP)
IDE KENSUKE (JP)

Application Number:

PCT/JP2011/067424

Publication Date:

April 05, 2012

Filing Date:

July 29, 2011

Export Citation:

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Assignee:

MITSUBISHI HEAVY IND LTD (JP)
TSUNO TAKESHI (JP)
GOTO TAKAYUKI (JP)
KINOUCHI MASATO (JP)
IDE KENSUKE (JP)

International Classes:

H01L21/02; B23K20/00

Foreign References:

JP2007281166A	2007-10-25
JP2007005335A	2007-01-11

Other References: