Title:
NORMAL TEMPERATURE BONDING DEVICE AND NORMAL TEMPERATURE BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/050915
Kind Code:
A1
Abstract:
A normal temperature bonding device is provided with a first beam source, a second beam source, and a pressure welding mechanism. The first beam source outputs a first activation beam that irradiates a first surface of a first substrate, and independently thereof, the second beam source outputs a second activation beam that irradiates a second surface of a second substrate. The pressure welding mechanism joins the first substrate and the second substrate by contact between the first surface and the second surface after the first activation beam has irradiated the first surface and the second activation beam has irradiated the second surface. Thus, a plurality of substrates of different materials is appropriately joined.
Inventors:
KINOUCHI MASATO (JP)
GOTO TAKAYUKI (JP)
TSUNO TAKESHI (JP)
UTSUMI JUN (JP)
IDE KENSUKE (JP)
SUZUKI TAKENORI (JP)
TSUTSUMI KEIICHIRO (JP)
TAKAGI HIDEKI (JP)
KURASHIMA YUUICHI (JP)
GOTO TAKAYUKI (JP)
TSUNO TAKESHI (JP)
UTSUMI JUN (JP)
IDE KENSUKE (JP)
SUZUKI TAKENORI (JP)
TSUTSUMI KEIICHIRO (JP)
TAKAGI HIDEKI (JP)
KURASHIMA YUUICHI (JP)
Application Number:
PCT/JP2013/075955
Publication Date:
April 03, 2014
Filing Date:
September 25, 2013
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
NAT INST OF ADVANCED IND SCIEN (JP)
NAT INST OF ADVANCED IND SCIEN (JP)
International Classes:
H01L21/02; B23K20/00
Foreign References:
| JP2009147257A | 2009-07-02 | |||
| JP2007005335A | 2007-01-11 | |||
| JP2005268766A | 2005-09-29 | |||
| JP2009010263A | 2009-01-15 | |||
| JP2791429B2 | 1998-08-27 | |||
| JP2004358602A | 2004-12-24 | |||
| JP4172806B2 | 2008-10-29 | |||
| US20100000663A1 | 2010-01-07 |
Other References:
See also references of EP 2881976A4
Attorney, Agent or Firm:
KUDOH Minoru (JP)
Minoru Kudo (JP)
Minoru Kudo (JP)
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