NORMAL TEMPERATURE BONDING DEVICE

WIPO Patent Application WO/2015/107855

A1

The normal temperature bonding device is equipped with a bonding chamber, an upper side stage mechanism whereby an upper side wafer is supported in such a way as to be vertically movable inside the bonding chamber, and a lower side stage mechanism whereby a lower side wafer is supported in such a way as to be movable within a horizontal plane inside the bonding chamber. The lower side stage mechanism comprises a carriage having a lower side wafer holding part for holding the lower side wafer, an elastic guide coupled to the carriage and supporting the carriage, a positioning stage for coarsely moving the lower side wafer holding part, a fine movement mechanism for finely moving the lower side wafer holding part, and a carriage support block. The elastic guide supports the carriage in such a manner that the carriage does not come into contact with the carriage support block when no load is being applied from the upper side stage mechanism onto the carriage, and elastically deforms so that the carriage comes into contact with the carriage support block when the upper side stage mechanism brings the upper side wafer into contact with the lower side wafer, thereby applying a vertical load onto the carriage.

KINOUCHI MASATO (JP)
GOTO TAKAYUKI (JP)
TSUNO TAKESHI (JP)
IDE KENSUKE (JP)
SUZUKI TAKENORI (JP)

PCT/JP2014/084495

July 23, 2015

December 26, 2014

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MITSUBISHI HEAVY IND LTD (JP)

H01L21/02; B23K20/00; H01L21/68; H01L21/683

JP2009208084A	2009-09-17
JP2011119293A	2011-06-16
JPH05160340A	1993-06-25
JP4822577B2	2011-11-24
JP4669766B2	2011-04-13
JP2005288637A	2005-10-20
JPH05160340A	1993-06-25
JP3970304B1	2007-09-05
JP4209457B1	2009-01-14

See also references of EP 3062333A4

KUDOH Minoru (JP)
Minoru Kudo (JP)

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