NOVEL INCLUSION COMPOUND - NIPPON SODA CO

Title:

NOVEL INCLUSION COMPOUND

Document Type and Number:

WIPO Patent Application WO/2014/156103

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a novel curing agent or curing accelerator for epoxy resin. This curing agent or curing accelerator for epoxy resin is an inclusion compound comprising the following (a1) and (a2). (a1) A tetrakis(hydroxyphenyl)ethane compound, or a carboxylic acid compound represented by the formula A(COOH)k (In the formula, A is a chain hydrocarbon group which may have a substituent of C1-C6, a monocyclic hydrocarbon group of C3-C10 which may have a substituent or a bicyclic hydrocarbon group of C6-C10 which may have a substituent, and k is 2 or 3.). (a2) A xylylenediamine compound.

Inventors:

ONO KAZUO (JP)
NOMURA TOMOYA (JP)

Application Number:

PCT/JP2014/001671

Publication Date:

October 02, 2014

Filing Date:

March 24, 2014

Export Citation:

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Assignee:

NIPPON SODA CO (JP)

International Classes:

C07C211/27; C07C39/15; C08G59/62

Domestic Patent References:

WO2011115020A1

2011-09-22

Foreign References:

JP2010535259A	2010-11-18
JP2006110793A	2006-04-27
JP2006110753A	2006-04-27
JP2008201111A	2008-09-04
JP2006152015A	2006-06-15
JPH09505852A	1997-06-10
JPH024831A	1990-01-09
JPS54113643A	1979-09-05
JPH1171449A	1999-03-16
JPH1171449A	1999-03-16
JP2007039449A	2007-02-15
JP2009091460A	2009-04-30

Other References: