Title:
NOVEL MOLDED FLOORING
Document Type and Number:
WIPO Patent Application WO/2023/216388
Kind Code:
A1
Abstract:
The present invention relates to the technical field of floorings. Disclosed is a novel molded flooring, comprising a base material and a core material. The base material has at least one core material filling cavity, the core material filling cavity is filled with the core material, and lock structures configured to be connected to adjacent floorings are circumferentially arranged on the side surface of the base material; the base material is made of a high-strength waterproof material, and the core material is made of a low-density foamed waterproof material. According to the novel molded flooring provided by the present invention, the problems of high material cost and high transportation cost of existing floorings are solved.
Inventors:
CHEN JUN (CN)
Application Number:
PCT/CN2022/102104
Publication Date:
November 16, 2023
Filing Date:
June 29, 2022
Export Citation:
Assignee:
CHENG GANG (CN)
10957402 CANADA INC (CA)
10957402 CANADA INC (CA)
International Classes:
E04F15/10; B32B5/00; E04F15/02
Foreign References:
| CN104631761A | 2015-05-20 | |||
| CN201411887Y | 2010-02-24 | |||
| CN217871568U | 2022-11-22 | |||
| CN210217022U | 2020-03-31 | |||
| CN201288379Y | 2009-08-12 | |||
| CN113389346A | 2021-09-14 | |||
| CN216196291U | 2022-04-05 | |||
| EP1247641A1 | 2002-10-09 | |||
| JP2005088245A | 2005-04-07 |
Attorney, Agent or Firm:
CHENGDU DINGFENG PATENT AGENCY (GENERAL PARTNER) (CN)
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