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Patent Searching and Data


Title:
NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS
Document Type and Number:
WIPO Patent Application WO2004081057
Kind Code:
A3
Abstract:
New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive formulation based on the disclosed PBO precursor polymers have good imaging and mechanical properties as well as superior shelf life stability. Photosensitive polybenzoxazole precursor polymers having (sulfon)amide end groups (with or without attached diazoquinone groups) can be formulated into photosensitive compositions with diazoquinone photoactive compounds which lack benzylic hydrogens on the backbone to yield compositions producing films significantly lighter in color after curing.

Inventors:
NAIINI AHMAD A (US)
RUSHKIN IYLA (US)
HOPLA RICHARD (US)
RACICOT DON (US)
Application Number:
PCT/US2004/007151
Publication Date:
December 21, 2006
Filing Date:
March 09, 2004
Export Citation:
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Assignee:
ARCH SPEC CHEM INC (US)
International Classes:
G03F7/023; C08F2/00; C08F36/00; C08G73/22; G03F7/30; C08F
Foreign References:
US6376151B12002-04-23
US5376499A1994-12-27
US6071666A2000-06-06
US20040229160A12004-11-18
US6177225B12001-01-23
US6127086A2000-10-03
US5449584A1995-09-12
US5037720A1991-08-06
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