NOVOLAC-RESIN-CONTAINING COMPOSITION FOR FORMING RESIST UNDERLAYER FILM USING BISPHENOL ALDEHYDE

WIPO Patent Application WO/2014/185335

A1

[Problem] To provide a composition for forming a resist underlayer film, for forming a resist underlayer film which has high dry-etching resistance and wiggling resistance and realizes good planarization properties or embedding properties with respect to a level difference or a relief part. [Solution] A composition for forming a resist underlayer film, including a resin obtained by reacting an organic compound (A) including an aromatic ring, and an aldehyde (B) having a structure which has at least two aromatic carbon ring groups having a phenolic hydroxy group and in which the aromatic carbon ring groups are bonded via a tertiary carbon atom. The aldehyde (B) is represented by formula (1), where Ar1 and Ar2 each represent a C6-C40 aryl group. The obtained resin is represented by formula (2). The organic compound (A) including an aromatic ring is an aromatic amine or a compound containing a phenolic hydroxy group. A solvent is further included. An acid and/or an acid generator, and a crosslinking agent are further included. A resist pattern formation method used to manufacture a semiconductor, including a step for applying, on a semiconductor substrate, the composition for forming a resist underlayer film, firing the applied composition, and forming an underlayer film.

ENDO TAKAFUMI (JP)
HASHIMOTO KEISUKE (JP)
NISHIMAKI HIROKAZU (JP)
SAKAMOTO RIKIMARU (JP)

PCT/JP2014/062352

November 20, 2014

May 08, 2014

Click for automatic bibliography generation  

NISSAN CHEMICAL IND LTD (JP)

G03F7/11; C08G14/073; G03F7/26; H01L21/027

JP2012145897A	2012-08-02
JPH07268049A	1995-10-17
JP2012098431A	2012-05-24
JPH05125149A	1993-05-21

HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)

View/Download PDF      PDF Help

Previous Patent: TROCAR, PORT AND SURGICAL SUPPORT SYSTEM

Next Patent: PAPER SHEET PROCESSING SYSTEM AND PAPER SHEET PROCESSING METHOD