Title:
NOZZLE HOLDING MECHANISM AND COMPONENT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/203626
Kind Code:
A1
Abstract:
In a component mounting device 10, when the nozzle holding surface 62 of a head 18 and the held surface 288 of a nozzle 28 are brought into contact, a recessed groove 64 is made into a pressure adjustment chamber C, and negative pressure is then supplied to the pressure adjustment chamber C, the held surface 288 of the nozzle 28 is suctioned to the nozzle holding surface 62 by the negative pressure. Additionally, a magnet 76 provided to the head 18 resists the urging of a coil spring 78 due to the negative pressure and is disposed from a normal position to an attraction position. When the nozzle 28 is removed, positive pressure is supplied to the pressure adjustment chamber C. The suction of the nozzle 28 to the head 18 due to the negative pressure is then released. Also, the magnet 76 is disposed in the normal position by the positive pressure and the urging of the coil spring 78, whereby the attraction of a metal plate 290 provided to the nozzle 28 is released.
Inventors:
IMURA JINYA (JP)
Application Number:
PCT/JP2016/065449
Publication Date:
November 30, 2017
Filing Date:
May 25, 2016
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
H05K13/04; B25J17/00
Foreign References:
| JP2004158658A | 2004-06-03 | |||
| JP2000091794A | 2000-03-31 | |||
| JP2006261325A | 2006-09-28 |
Other References:
See also references of EP 3468331A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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