Title:
NUMERICAL CONTROL APPARATUS
Document Type and Number:
WIPO Patent Application WO/2012/014479
Kind Code:
A1
Abstract:
Disclosed is a numerical control apparatus which comprises: a special command input device for inputting, from outside, a special command for instructing an operation involving a velocity change of a moving target object separate from normal transfer of the moving target object during processing of a workpiece; a calculation unit for calculating, on the basis of a processing path, the amount of movement in the movement axis direction of supports per set unit time; and a driving control unit for transferring corresponding supports to drive devices in accordance with the amount of movement of the supports calculated by the calculation unit. In response to the special command being input in the special command input device, the calculation unit changes the length of the set unit time from the length immediately prior to the input of the special command to a length corresponding to the velocity change of the moving target object instructed by the special command, and calculates from the processing path the amount of movement in the movement axis direction of the supports per set unit time after the length has been changed.
More Like This:
| JP2005132029 | DC MOTOR CONTROLLER AND RECORDER |
| JP08129410 | POSITIONING DEVICE |
| JP3907989 | SPINDLE HEAD CENTER OF GRAVITY CORRECTING DEVICE |
Inventors:
NISHIBASHI, Nobutaka (())
Application Number:
JP2011/004277
Publication Date:
February 02, 2012
Filing Date:
July 28, 2011
Export Citation:
Assignee:
SHIN NIPPON KOKI CO., LTD. (4-1 Kitakyuhojimachi 2-chome, Chuo-ku Osaka-sh, Osaka 57, 〒5410057, JP)
新日本工機株式会社 (〒57 大阪府大阪市中央区北久宝寺町二丁目４番１号 Osaka, 〒5410057, JP)
新日本工機株式会社 (〒57 大阪府大阪市中央区北久宝寺町二丁目４番１号 Osaka, 〒5410057, JP)
International Classes:
G05B19/404; G05B19/416
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Building 2nd Floor, 2-2 Nakanoshima 2-chome,Kita-ku, Osaka-shi, Osaka 05, 〒5300005, JP)
Download PDF:
Claims:
Previous Patent: EPOXY RESIN AND MANUFACTURING METHOD FOR SAME
Next Patent: PHENOL RESIN AND EPOXY RESIN AND MANUFACTURING METHOD FOR SAME
Next Patent: PHENOL RESIN AND EPOXY RESIN AND MANUFACTURING METHOD FOR SAME