Title:
OBJECT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/118677
Kind Code:
A1
Abstract:
In the prior art, since problems in component mounting are not found until an inspection step, which is at the final stage of a product, the costs for inspecting and repairing defects would significantly increase in proportion to how late the defect was discovered in the product. As a result, there has been a need for a system that can detect a mounting failure at a stage at or prior to the inspection process. In order to resolve the above problem, the present invention provides an object mounting device which comprises a sensor which obtains a pressure value for an object supporting portion when the object is placed on a flat surface, and an image sensor which, if the pressure value is outside a threshold, performs image-capture of the mounting position for the object and assesses whether there is a failure in mounting a component. Therefore, it is possible to detect a failure in mounting at a mounting stage or immediately subsequent to mounting.
Inventors:
TAKAGI TOYOKAZU (JP)
ITO KIYOTO (JP)
TAKAHIRA ISAO (JP)
SAEGUSA TAKASHI (JP)
INOUE TOMOHIRO (JP)
FUNATSU TERUNOBU (JP)
ITO KIYOTO (JP)
TAKAHIRA ISAO (JP)
SAEGUSA TAKASHI (JP)
INOUE TOMOHIRO (JP)
FUNATSU TERUNOBU (JP)
Application Number:
PCT/JP2014/052992
Publication Date:
August 13, 2015
Filing Date:
February 10, 2014
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H05K13/04; H05K13/08
Foreign References:
JP2013197262A | 2013-09-30 | |||
JP2010177549A | 2010-08-12 | |||
JPH0715183A | 1995-01-17 | |||
JP3987648B2 | 2007-10-10 | |||
JP4100741B2 | 2008-06-11 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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