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Patent Searching and Data


Title:
OBJECT MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/118677
Kind Code:
A1
Abstract:
In the prior art, since problems in component mounting are not found until an inspection step, which is at the final stage of a product, the costs for inspecting and repairing defects would significantly increase in proportion to how late the defect was discovered in the product. As a result, there has been a need for a system that can detect a mounting failure at a stage at or prior to the inspection process. In order to resolve the above problem, the present invention provides an object mounting device which comprises a sensor which obtains a pressure value for an object supporting portion when the object is placed on a flat surface, and an image sensor which, if the pressure value is outside a threshold, performs image-capture of the mounting position for the object and assesses whether there is a failure in mounting a component. Therefore, it is possible to detect a failure in mounting at a mounting stage or immediately subsequent to mounting.

Inventors:
TAKAGI TOYOKAZU (JP)
ITO KIYOTO (JP)
TAKAHIRA ISAO (JP)
SAEGUSA TAKASHI (JP)
INOUE TOMOHIRO (JP)
FUNATSU TERUNOBU (JP)
Application Number:
PCT/JP2014/052992
Publication Date:
August 13, 2015
Filing Date:
February 10, 2014
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
H05K13/04; H05K13/08
Foreign References:
JP2013197262A2013-09-30
JP2010177549A2010-08-12
JPH0715183A1995-01-17
JP3987648B22007-10-10
JP4100741B22008-06-11
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
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