OFF-ANGLED HEATING OF THE UNDERSIDE OF A SUBSTRATE USING A LAMP ASSEMBLY

WIPO Patent Application WO/2012/125469

A3

Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. A method of processing a substrate having apertures formed in a first surface thereof includes depositing material on the first surface in the apertures and reflowing the material by heating a second surface of the substrate opposite the first surface. A second material can then be deposited, filling the apertures partly or completely. Alternately, a cyclical deposition/reflow process may be performed.

JPH0590163	THIN FILM FORMING APPARATUS
JP2003007625	SUBSTRATE-PROCESSING APPARATUS
JPH02159018	REDUCED PRESSURE VAPOR PHASE GROWTH DEVICE

EWERT MAURICE E (US)
SUBRAMANI ANANTHA K (US)
KELKAR UMESH M (US)
BALASUBRAMANYAM CHANDRASEKHAR (IN)
RANISH JOSEPH M (US)

PCT/US2012/028521

December 27, 2012

March 09, 2012

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APPLIED MATERIALS INC (US)
EWERT MAURICE E (US)
SUBRAMANI ANANTHA K (US)
KELKAR UMESH M (US)
BALASUBRAMANYAM CHANDRASEKHAR (IN)
RANISH JOSEPH M (US)

H01L21/205

US6222990B1	2001-04-24
US20040149715A1	2004-08-05
US6313027B1	2001-11-06
US20070020872A1	2007-01-25

PATTERSON, B. Todd et al. (L.L.P.3040 Post Oak Blvd., Suite 150, Houston Texas, US)

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