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Patent Searching and Data


Title:
OFFSET PRINTING PLATE, OFFSET PRINTING APPARATUS, AND OFFSET PRINTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/077825
Kind Code:
A1
Abstract:
Provided are an offset printing plate, an offset printing apparatus, and an offset printing method capable of printing a high-definition image with waterless offset printing. The offset printing plate comprises: a cylindrical plate base material; a silicon resin layer formed on the plate base material; and a resist pattern part formed on the silicon resin layer, wherein the silicon resin layer is a non-image part, and the resist pattern part is an image part. The silicon resin layer is preferably formed on the plate base material seamlessly.

Inventors:
SHIGETA TATSUO (JP)
Application Number:
PCT/JP2016/080209
Publication Date:
May 11, 2017
Filing Date:
October 12, 2016
Export Citation:
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Assignee:
THINK LABS KK (JP)
International Classes:
B41N1/14; B41M1/08; B41N1/16; G03F7/00; G03F7/09; G03F7/11
Foreign References:
JP2001026185A2001-01-30
JPH09150589A1997-06-10
JPH04263994A1992-09-18
JP2004517752A2004-06-17
JP2010076387A2010-04-08
JP2013111860A2013-06-10
JPH10130559A1998-05-19
Other References:
See also references of EP 3372419A4
Attorney, Agent or Firm:
ISHIHARA, Shinsuke et al. (JP)
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