Title:
OLED PACKAGING STRUCTURE AND PACKAGING METHOD, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/248786
Kind Code:
A1
Abstract:
The present disclosure relates to the technical field of display, and disclosed are an OLED packaging structure and packaging method, and a display apparatus. The purpose that the packaging structure does not influence the display performance of an OLED device while ensuring a uniform cell gap between a display substrate and a packaging cover plate is achieved. The main technical solution of the present disclosure is: a packaging cover plate, wherein a sealant layer is arranged on the edge of a first surface of the packaging cover plate opposite to a display substrate in an annular configuration, a region encircled by the sealant layer is filled with a filling adhesive layer, a plurality of support blocks having preset flexibility are distributed in a region corresponding to the sealant layer, and the thickness of the support block is equal to a preset distance between the packaging cover plate and the display substrate.
Inventors:
LUO CHENGYUAN (CN)
Application Number:
PCT/CN2020/091380
Publication Date:
December 17, 2020
Filing Date:
May 20, 2020
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L51/52
Foreign References:
| CN110112323A | 2019-08-09 | |||
| CN104241547A | 2014-12-24 | |||
| CN109546003A | 2019-03-29 | |||
| CN107359270A | 2017-11-17 | |||
| CN104393186A | 2015-03-04 | |||
| CN1557028A | 2004-12-22 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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