OLED SUBSTRATE CUTTING DEVICE AND OLED SUBSTRATE

WIPO Patent Application WO/2015/152395

A1

Provided is an OLED substrate cutting device which enables the reduction of cracking of a barrier layer. An OLED substrate cutting device (1) is a device for cutting an OLED substrate (2) provided with a substrate, a barrier layer provided on one surface side of the substrate, a plurality of layers provided on a portion on one surface side of the barrier layer, and an adhesive sheet provided on the other surface side of the substrate, and is provided with a base part (10) to which the adhesive sheet is affixed, and a first blade part (21) which cuts the OLED substrate from the side of the plurality of layers in a state where the adhesive sheet is affixed to the base part (10). The first blade part (21) is a linear blade longer than the width of the OLED substrate (2), and cuts the OLED substrate (2) in a state where both ends of the first blade part (21) are respectively located outside both ends of the OLED substrate (2).

NAGASAKI MITSURU (JP)
SAKAI TAKASHI (JP)

PCT/JP2015/060589

October 08, 2015

April 03, 2015

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KONICA MINOLTA INC (JP)

B26D3/00; B26D1/06; B26F1/44; H01L51/50; H05B33/10

WO2007029474A1	2007-03-15
WO2010067721A1	2010-06-17

JP2012226013A	2012-11-15
JP2006332187A	2006-12-07
JP2013164935A	2013-08-22
JP2008137346A	2008-06-19
JP2008077854A	2008-04-03
JP2007073225A	2007-03-22
JP2014116115A	2014-06-26

ISONO INTERNATIONAL PATENT OFFICE, P. C. (JP)
Patent business corporation Isono international patent trademark office (JP)

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