ONE-COMPONENT POLISHING SLURRY COMPOSITION AND POLISHING METHOD USING SAME

Title:

ONE-COMPONENT POLISHING SLURRY COMPOSITION AND POLISHING METHOD USING SAME

Document Type and Number:

WIPO Patent Application WO/2020/138737

Kind Code:

A1

Abstract:

The present invention relates to a one-component polishing slurry composition and a polishing method using same and, more specifically, to a one-component polishing slurry composition and a polishing method using same, the one-component polishing slurry composition comprising: abrasive particles; and a polishing selectivity regulator, wherein the polishing selectivity regulator provides a change in the polishing selectivity of non-Prestonian behavior according to polishing pressure.

Inventors:

KONG HYUN GOO (KR)
HWANG JIN SOOK (KR)
HWANG IN SEOL (KR)

Application Number:

PCT/KR2019/016567

Publication Date:

July 02, 2020

Filing Date:

November 28, 2019

Export Citation:

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Assignee:

KCTECH CO LTD (KR)

International Classes:

C09G1/02; C09K3/14; H01L21/304; H01L21/321

Foreign References:

KR20090036987A	2009-04-15
KR20160121229A	2016-10-19
JP2001176826A	2001-06-29
KR20150044479A	2015-04-27
KR20160080555A	2016-07-08
KR101472858B1	2014-12-17
KR20180073131A	2018-07-02

Attorney, Agent or Firm:

MUHANN PATENT & LAW FIRM (KR)

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