Title:
ONE-SIDED DIODE CHIP
Document Type and Number:
WIPO Patent Application WO/2019/134596
Kind Code:
A1
Abstract:
Disclosed is a one-sided diode chip, comprising: a one-sided diode chip main body; a positive electrode; and a negative electrode. The positive electrode and the negative electrode are electrically connected to the one-sided diode chip main body, and are arranged at the same side of the one-sided diode chip main body. In the technical solution of the present invention, the positive electrode and the negative electrode are arranged at the same side of the one-sided diode chip main body, and thus only one package frame is required for packaging the one-sided diode chip main body. When soldered to a circuit board, the one-sided diode chip does not occupy a large space of the circuit board, thereby effectively reducing an area for soldering.
Inventors:
CHEN LIN (CN)
Application Number:
PCT/CN2018/125049
Publication Date:
July 11, 2019
Filing Date:
December 28, 2018
Export Citation:
Assignee:
MAANSHAN BENCENT ELECTRONICS CO LTD (CN)
International Classes:
H01L29/861
Foreign References:
| CN108054216A | 2018-05-18 | |||
| CN207705202U | 2018-08-07 | |||
| CN106449731A | 2017-02-22 | |||
| CN205789993U | 2016-12-07 | |||
| CN104409520A | 2015-03-11 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
Download PDF: