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Patent Searching and Data


Title:
ONE-SIDED DIODE CHIP
Document Type and Number:
WIPO Patent Application WO/2019/134596
Kind Code:
A1
Abstract:
Disclosed is a one-sided diode chip, comprising: a one-sided diode chip main body; a positive electrode; and a negative electrode. The positive electrode and the negative electrode are electrically connected to the one-sided diode chip main body, and are arranged at the same side of the one-sided diode chip main body. In the technical solution of the present invention, the positive electrode and the negative electrode are arranged at the same side of the one-sided diode chip main body, and thus only one package frame is required for packaging the one-sided diode chip main body. When soldered to a circuit board, the one-sided diode chip does not occupy a large space of the circuit board, thereby effectively reducing an area for soldering.

Inventors:
CHEN, Lin (No. 2189, South Huxi RoadMaanshan, Anhui 0, 243000, CN)
Application Number:
CN2018/125049
Publication Date:
July 11, 2019
Filing Date:
December 28, 2018
Export Citation:
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Assignee:
MAANSHAN BENCENT ELECTRONICS CO., LTD. (No. 2189, South Huxi RoadMaanshan, Anhui 0, 243000, CN)
International Classes:
H01L29/861
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (201 Aotex Power Building, North Zone High-Tech Industrial Park,No. 3, Songping Mountain Road, Nanshan Distric, Shenzhen Guangdong 7, 518057, CN)
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