Title:
OPTICAL COMMUNICATION IN A RAMP-STACK CHIP PACKAGE
Document Type and Number:
WIPO Patent Application WO/2012/027081
Kind Code:
A3
Abstract:
A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a stepped terrace. A high-bandwidth ramp component, which is positioned approximately parallel to the stepped terrace, is mechanically coupled to the semiconductor dies. Furthermore, the ramp component includes an optical waveguide that conveys the optical signal, and an optical coupling component that optically couples the optical signal to one of the semiconductor dies, thereby facilitating high-bandwidth communication of the optical signal between the semiconductor die and the ramp component.
Inventors:
HARADA JOHN A (US)
DOUGLAS DAVID C (US)
DROST ROBERT J (US)
DOUGLAS DAVID C (US)
DROST ROBERT J (US)
Application Number:
PCT/US2011/046518
Publication Date:
April 19, 2012
Filing Date:
August 04, 2011
Export Citation:
Assignee:
ORACLE INT CORP (US)
HARADA JOHN A (US)
DOUGLAS DAVID C (US)
DROST ROBERT J (US)
HARADA JOHN A (US)
DOUGLAS DAVID C (US)
DROST ROBERT J (US)
International Classes:
H01L23/66; H01L25/065
Domestic Patent References:
| WO1999040627A1 | 1999-08-12 |
Foreign References:
| US6376904B1 | 2002-04-23 | |||
| JP2001036309A | 2001-02-09 |
Attorney, Agent or Firm:
SAHASRABUDDHE, Laxman (Davis, California, US)
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