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Title:
OPTICAL COMPONENT AND SEMICONDUCTOR LASER MODULE
Document Type and Number:
WIPO Patent Application WO/2020/184603
Kind Code:
A1
Abstract:
An optical component (10) is provided with: an optical fiber (11) including a core portion (11a) and a cladding portion (11b) formed on an outer periphery of the core portion (11a); a light absorber (13) disposed on the outer periphery of the optical fiber (11); and a securing material (12) securing the light absorber (13) and the optical fiber (11) to each other. The cladding portion (11b) includes a main portion (11ba) extending in a longitudinal direction and having a main portion cladding diameter (Aba), and an input-side end portion (11bb) positioned on a light input side with respect to the main portion (11ba). An input end surface cladding diameter (Abb) of an input end surface (11c) of the input-side end portion (11bb) is smaller than the main portion cladding diameter (Aba).

Inventors:
HAYAMIZU NAOKI (JP)
HASHIMOTO HIROSHI (JP)
NASU HIDEYUKI (JP)
Application Number:
PCT/JP2020/010460
Publication Date:
September 17, 2020
Filing Date:
March 11, 2020
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
G02B6/02; G02B6/42; H01S5/02218
Domestic Patent References:
WO2015037725A12015-03-19
WO2017134911A12017-08-10
WO2015037725A12015-03-19
Foreign References:
US20120262938A12012-10-18
JP2019028414A2019-02-21
US20050196108A12005-09-08
JPH01316705A1989-12-21
JP2017223897A2017-12-21
Other References:
See also references of EP 3940899A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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