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Title:
OPTICAL DEVICE, SPECTRAL SENSOR MODULE, IMAGING MODULE, AND METHOD FOR MANUFACTURING OPTICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/100688
Kind Code:
A1
Abstract:
The present invention is capable of preventing unwanted light from entering the optical path through which light is transmitted from an object. A non-transparent 3D circuit board 2 that energizes a light receiving unit 8 from the 3D circuit board 2 holds therein: optical components 4, 6 whereon light from an object is incident; a selective transmission material 7 that allows light with a prescribed wavelength, from the light transmitted through the optical components, to pass therethrough; and the light receiving unit 8 that receives the light transmitted through the selective transmission material.

Inventors:
HARAZONO FUMIKAZU (JP)
Application Number:
PCT/JP2019/043508
Publication Date:
May 22, 2020
Filing Date:
November 06, 2019
Export Citation:
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Assignee:
MICRO MODULE TECH CO LTD (JP)
International Classes:
G03B11/00; G02B7/02; G03B17/02; H01L31/02; H01L31/0232; H04N5/225
Domestic Patent References:
WO2017094777A12017-06-08
Foreign References:
JP2009218918A2009-09-24
JP2016184082A2016-10-20
JP2018040623A2018-03-15
JPH09145601A1997-06-06
JP2008216055A2008-09-18
Attorney, Agent or Firm:
SAKATA Yukari (JP)
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