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Patent Searching and Data


Title:
OPTICAL FILM BONDING DEVICE AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/114936
Kind Code:
A1
Abstract:
Disclosed are an optical film bonding device and bonding method that can bond an optical film with increased efficiency. Said optical film bonding device continuously bonds an optical film to a substrate, using a strip-shaped master optical film (1) wound into a roll. The width of the strip-shaped master optical film (1) is nearly twice that needed for the substrate (10). The disclosed optical film bonding device is provided with: a transfer roller (6) that spools out the strip-shaped master optical film (1) in the long direction thereof; a cutting means (8) that cuts the spooled-out strip-shaped master optical film (1), in the long direction thereof, into a first strip-shaped optical film (4), having a width equal to that needed for the substrate (10), and a second strip-shaped optical film (5); a bonding roller (11) that bonds the first strip-shaped optical film (4) to the substrate (10); and a transfer roller (7) that takes up the second strip-shaped optical film (5).

Inventors:
IMURA KEITA
OIKAWA SHIN
TSUCHIOKA TATSUYA
Application Number:
PCT/JP2011/055304
Publication Date:
September 22, 2011
Filing Date:
March 08, 2011
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
IMURA KEITA
OIKAWA SHIN
TSUCHIOKA TATSUYA
International Classes:
G09F9/00; G02B5/30; G02F1/1335
Foreign References:
JP4346971B22009-10-21
JP4307510B12009-08-05
JPS51493A1976-01-06
JPS5980343U1984-05-30
JPH04334450A1992-11-20
JP2004284718A2004-10-14
Attorney, Agent or Firm:
HASEGAWA, Kazuya et al. (JP)
Kazuya Hasegawa (JP)
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Claims: