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Patent Searching and Data


Title:
OPTICAL FILM CHIP CUTTING DEVICE AND METHOD FOR CUTTING OPTICAL FILM CHIP
Document Type and Number:
WIPO Patent Application WO/2013/069766
Kind Code:
A1
Abstract:
An optical film chip cutting device comprises a cutting device for cutting optical film, and a control device for acquiring optical film optic axis in-plane distribution data, and, based on the optical film optic axis in-plane distribution data, varying the direction of cutting of the optical film by the cutting device within the optical film plane.

Inventors:
FUJII MIKIO (JP)
Application Number:
JP2012/079116
Publication Date:
May 16, 2013
Filing Date:
November 09, 2012
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Assignee:
SUMITOMO CHEMICAL COMPANY, LIMITED (27-1, Shinkawa 2-chome Chuo-k, Tokyo 60, 〒1048260, JP)
International Classes:
G02B5/30; B26D3/00; B26D5/00
Foreign References:
JP2001047395A
JPS618297A
JPH1195028A
Attorney, Agent or Firm:
TANAI Sumio et al. (1-9-2, Marunouchi Chiyoda-k, Tokyo 20, 〒1006620, JP)
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Claims: