Title:
OPTICAL INTERCONNECTS IN COOLING SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2012/011046
Kind Code:
A1
Abstract:
Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.
Inventors:
JULIEN, Martin (1095 rue Gilles, Laval, Québec H7P 5H1, CA)
BRUNNER, Robert (8048 Querbes Ave, Montreal, Québec H3N 2C1, CA)
BRUNNER, Robert (8048 Querbes Ave, Montreal, Québec H3N 2C1, CA)
Application Number:
IB2011/053201
Publication Date:
January 26, 2012
Filing Date:
July 18, 2011
Export Citation:
Assignee:
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) (SE - Stockholm, 164 83, SE)
JULIEN, Martin (1095 rue Gilles, Laval, Québec H7P 5H1, CA)
BRUNNER, Robert (8048 Querbes Ave, Montreal, Québec H3N 2C1, CA)
JULIEN, Martin (1095 rue Gilles, Laval, Québec H7P 5H1, CA)
BRUNNER, Robert (8048 Querbes Ave, Montreal, Québec H3N 2C1, CA)
International Classes:
G02B6/42; G02B6/43; H01L23/46; H01L23/467; H01L23/473; H01L25/16; H04B10/00; H05K1/02
Attorney, Agent or Firm:
NICOLAESCU, Alex et al. (8400 Decarie Blvd, Town of Mount Royal, Québec H4P 2N2, CA)
Download PDF:
Claims: