Title:
OPTICAL LED MODULE AND METHOD OF MANUFACTURING OPTICAL LED MODULE
Document Type and Number:
WIPO Patent Application WO/2013/094833
Kind Code:
A1
Abstract:
The present invention relates to a method of manufacturing an optical LED module, comprising: an LED surface mounting step (S10) of surface mounting through solder masking an LED on a top surface of a group of printed circuit boards; a connection pin fixing step (S20) of passing connection pins through the printed circuit boards that have undergone the LED surface mounting step (S10) such that the connection pins pass through to project downward from the printed circuit boards, and soldering the connection pins and the printed circuit boards; a wire coating step (S30) of disposing each of the printed circuit boards at uniform intervals with the connection pins fixed by means of the connection pin fixing step (S20), disposing wires to be connected to the connection pins projecting from the undersurface of each printed circuit board, and stripping the regions of the wires corresponding to the positions at which they connect to each of the connection pins; and an epoxy molding step (S40) of pre-fixing the coated wire portions with the connection pins in a state where the coated regions of the wires and the connection pins are connected by means of the wire coating step (S30), and then performing epoxy molding sequentially on the plurality of printed circuit boards disposed at uniform intervals along the wires such that one group of printed circuit boards is completely enclosed. A thus-manufactured LED module is provided, and individual printed circuit boards are prepared in the same manner as when manufacturing existing LED modules for advertisements by surface mounting LEDs on the top surfaces of the printed circuit boards, then configuring connection pins, and epoxy mold processing the top surfaces of the printed circuit boards. After injection molding a case and a cover for receiving the printed circuit boards by using resin or the like, the wires that are coated are arranged at uniform intervals, the connection pins of the printed circuit boards are positioned to connect to the coated regions of the wires, and then the wires are stripped in the serial process of epoxy mold processing the undersurface sides of the printed circuit boards. With the coated wires pre-connected at uniform intervals to the connection pins fixed on the undersurface sides of the printed circuit boards that have the LEDs surface mounted thereon, the printed circuit boards are epoxy molded overall to enable the convenient manufacturing of an LED module having good water tightness and air tightness. Thus, a method of manufacturing an LED module for advertisements and an LED module for advertisements which is manufactured through same can be expected to have the effects of simplifying the manufacturing process of an LED module for advertisements and securing good product reliability.
Inventors:
HAN YOON-HEE (KR)
Application Number:
PCT/KR2012/005066
Publication Date:
June 27, 2013
Filing Date:
June 27, 2012
Export Citation:
Assignee:
HAN YOON-HEE (KR)
International Classes:
G09F13/22; F21S2/00; F21Y101/02
Foreign References:
| KR20090119318A | 2009-11-19 | |||
| KR20060090149A | 2006-08-10 | |||
| KR20090060713A | 2009-06-15 | |||
| KR20090018073A | 2009-02-19 |
Attorney, Agent or Firm:
RHEE, We-Beg (KR)
이외백 (KR)
이외백 (KR)
Download PDF:
Claims: